JPH0476092U - - Google Patents
Info
- Publication number
- JPH0476092U JPH0476092U JP11962190U JP11962190U JPH0476092U JP H0476092 U JPH0476092 U JP H0476092U JP 11962190 U JP11962190 U JP 11962190U JP 11962190 U JP11962190 U JP 11962190U JP H0476092 U JPH0476092 U JP H0476092U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- copper foil
- wiring board
- printed wiring
- dissipation device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962190U JPH0476092U (en]) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11962190U JPH0476092U (en]) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476092U true JPH0476092U (en]) | 1992-07-02 |
Family
ID=31867566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11962190U Pending JPH0476092U (en]) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476092U (en]) |
-
1990
- 1990-11-14 JP JP11962190U patent/JPH0476092U/ja active Pending
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